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On-Demand Webinars |
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Date/Time |
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Length |
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Co-simulation Enables Efficient Co-Design of WLAN Antenna and Circuitry
Agilent Technologies |
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May 28, 2008 |
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60 min. |
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Using the New SystemC TLM-2.0 Standard for the Creation of Virtual Platforms for Software Development and Architecture Design
CoWare |
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May 20, 2008 |
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60 min. |
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Chip-Package Co-Design: Applying Chip Power Model in System Power Integrity Analysis
Apache Design Solutions |
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May 08, 2008 |
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60 min. |
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Selecting the Optimal Embedded Memory IP Architecture
Synopsys |
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May 01, 2008 |
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60 min. |
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DSPF Back-Annotation Flow in Design Architect IC
Mentor Graphics |
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Feb 06, 2008 |
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15 min. |
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Approaching Yield in the Nanometer Age
Mentor Graphics |
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Feb 06, 2008 |
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90 min. |
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Co-Simulation with MATLAB® Simulink®. and HDL Simulators
The Mathworks |
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Dec 06, 2007 |
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60 min. |
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Manage Power at Each Design Stage with a Production-Proven, Holistic Solution to Low-Power Design
Cadence |
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Nov 06, 2007 |
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60 min. |
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System-level Platform For 10-200 Watt Color Mixing Applications
NXP SemiConductor |
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Oct 09, 2007 |
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60 min. |
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New Interconnect Technologies for Commercial Vehicles, Recreational/Specialty Vehicles, and Automotive Electronic Systems
TTI Inc. |
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Oct 04, 2007 |
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60 min. |
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New Component Technologies in Transportation Electronic Systems
TTI Inc. |
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Sep 27, 2007 |
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60 min. |
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Industrial Applications For CAN Bus
NXP |
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Sep 11, 2007 |
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60 min. |
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Circuit-Simulation-Driven RF/Analog System-In-Package Design
Cadence |
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Sep 06, 2007 |
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60 min. |
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RF Board Design for Next Generation Wireless Systems
Agilent Technologies |
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Aug 29, 2007 |
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60 min. |
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Connecting to DDR2: Mitigating High-Speed Challenges in SoC Designs
Synopsys |
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Jul 25, 2007 |
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90 min. |
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