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On-Demand Webinars

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EDA
  Co-simulation Enables Efficient Co-Design of WLAN Antenna and Circuitry
Agilent Technologies
  May 28, 2008   60 min.
  Using the New SystemC TLM-2.0 Standard for the Creation of Virtual Platforms for Software Development and Architecture Design
CoWare
  May 20, 2008   60 min.
  Chip-Package Co-Design: Applying Chip Power Model in System Power Integrity Analysis
Apache Design Solutions
  May 08, 2008   60 min.
  Selecting the Optimal Embedded Memory IP Architecture
Synopsys
  May 01, 2008   60 min.
  DSPF Back-Annotation Flow in Design Architect IC
Mentor Graphics
  Feb 06, 2008   15 min.
  Approaching Yield in the Nanometer Age
Mentor Graphics
  Feb 06, 2008   90 min.
  Co-Simulation with MATLAB® Simulink®. and HDL Simulators
The Mathworks
  Dec 06, 2007   60 min.
  Manage Power at Each Design Stage with a Production-Proven, Holistic Solution to Low-Power Design
Cadence
  Nov 06, 2007   60 min.
  System-level Platform For 10-200 Watt Color Mixing Applications
NXP SemiConductor
  Oct 09, 2007   60 min.
  New Interconnect Technologies for Commercial Vehicles, Recreational/Specialty Vehicles, and Automotive Electronic Systems
TTI Inc.
  Oct 04, 2007   60 min.
  New Component Technologies in Transportation Electronic Systems
TTI Inc.
  Sep 27, 2007   60 min.
  Industrial Applications For CAN Bus
NXP
  Sep 11, 2007   60 min.
  Circuit-Simulation-Driven RF/Analog System-In-Package Design
Cadence
  Sep 06, 2007   60 min.
  RF Board Design for Next Generation Wireless Systems
Agilent Technologies
  Aug 29, 2007   60 min.
  Connecting to DDR2: Mitigating High-Speed Challenges in SoC Designs
Synopsys
  Jul 25, 2007   90 min.
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