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Ultra Thin Profile RGB LED Module

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November 2006
 

Mok Thye Linn
Avago Technologies

The use of Red, Green and Blue (RGB) Light Emitting Diodes (LEDs) to backlight liquid crystal display (LCD) panels is a must to achieving a superior color gamut in monitors and TVs. The tradeoffs in using RGB LED backlighting include the efficiency and cost of the LED assemblies. A new package is needed to properly address this LED backlight market. Avago developed a chip-on-board (COB) package which combines a compact and low profile package outline with good color mixing and efficient thermal management. This package demonstrates that COB technology can still be an attractive option for LED package designers because of its cost effectiveness and its ability to incorporate simple electrical connections.

 
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