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Putting the Smarts into Smart Things - Designing ICs for the Internet of Things

Original Air Date: Dec 17, 2013 | Duration: 60 minutes Webinar
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Overview:
The Internet of Things is expected to be the largest semiconductor growth segment over the next 5 years with over 20 Billion devices anticipated to be in use by 2020. Microcontrollers (MCUs) are at the heart of these applications providing local processing and communication. To participate in this highly competitive market, MCU suppliers leave no stone unturned; using advanced design techniques, IP and tools to minimize costs and power while rapidly incorporating the latest complex functionality consumers require.

Using a recently introduced wearable device application example, this webinar will discuss:

  • The trends and unique challenges designers face when developing next-generation MCUs.
  • How designers are using the latest Synopsys design and implementation tools with proven DesignWare┬« IP solutions to meet their demanding requirements.
  • Synopsys' recent innovations to shorten design turnaround time, while reducing power consumption and costs for MCU designs.

Who should attend: Design engineers, project leads and managers tasked with developing low cost, low power ICs.

Presenter:
Andy Biddle, Solution Marketing Manager, Synopsys
Andy Biddle is responsible for marketing EDA tool solutions in Synopsys' Implementation Group. He has over 30 years' experience in the semiconductor industry with the last six years in EDA. Andy has held a number of senior positions including ASIC design, sales, business development, strategic marketing and product marketing. He holds a Bachelor of Science in Electrical and Electronic Engineering from London South Bank University.

1 comment
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Dr DSP Posted Dec 16, 2013

Looking forward to the presentation. Interested in the security aspects of IoT implementations.

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