Stay Ahead of USB 3.1 Test Challenges
Whether you're developing a next-gen USB 3.1 device or integrating existing silicon, you probably have questions about "SuperSpeed USB". USB 3.1 transforms the workhorse USB interface into a high-speed (up to 10 Gb/s), high-power (up to 100 watts) platform that remains compatible with its predecessors. As with any new technology, interoperability issues are sure to emerge—and new characterization and validation challenges are coming your way. Join us for a head start on the tools and techniques you'll need to get your USB 3.1 design work done right, including a complete overview of the new specification and details on 10 Gb/s signaling—and the test challenges that come with it.
Join the webinar to learn about:
- Physical layer differences between USB 3.1 and 3.0
- USB 10 Gb/s channel definition and jitter budget
- New 128b/132b encoding and impact on test solutions
- Transmitter validation methodologies including link analysis
- Updated training sequence, compliance patterns and jitter tolerance requirements for receiver testing
Randy White, Product Manager for Oscilloscopes, Tektronix
Randy White is the Product Manager for Oscilloscopes at Tektronix. He has worked in the test and measurement industry for 10 years. Randy holds a BSEE from Oregon State University, and a MBA from Portland State University.