Accurate and Efficient Wideband On-wafer Flicker (1/f) Noise Measurement
1/f noise, or flicker noise is a very key device characteristic which directly impacts the circuit performance, and has also been used to characterize the manufacturing process quality. However, accurately measuring 1/f noise at wafer level is challenging and time consuming, especially at advanced process nodes. This webinar will go through all the key aspects of how to improve wafer-level 1/f noise measurement and validate its data, and introduce the latest generation measurement system from ProPlus, and describe its capabilities such as how it maintains the highest accuracy, delivers true 10MHz measurement bandwidth and increases measurement throughput.
What attendees will learn:
- Architecture of a modern noise measure system
- The keys for on-wafer noise measurement and how to validate noise data
- How to improve noise measurement quality for different devices at different bias conditions
- How to improve noise measurement resolution & measurement throughput while extending noise measurement to a higher frequency
- Improvements of noise system 9812D over 9812B
- Unique capabilities of 9812D versus other commercial systems
Academics, engineers and management looking for solutions to improve on-wafer noise measurement quality.
Attendees will also have a chance to interact with the presenter during a 10-minute Q&A session. Attendees can also contact ProPlus (email@example.com) directly after the Webinar.
Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, Inc.
Dr. Zhihong Liu currently serves as the Executive Chairman of ProPlus Design Solutions, Inc. He was most recently the Corporate Vice President for CSV R&D at Cadence Design Systems Inc. Dr. Liu co-founded BTA Technology Inc. in 1993 and invented BSIMPro, the world's most leading Spice modeling product. He also served as the President & CEO of BTA Technology Inc. and later Celestry Design Technology Inc., which was acquired by Cadence in 2003.
Dr. Liu holds a Ph.D. degree in EE from the University of Hong Kong and co-developed the industry's first standard model (BSIM3) for IC designs as one of the main contributors at the University of California at Berkeley.