3D process modeling enables virtual fabrication for complex semiconductor development

Recent semiconductor technology advances, including FinFET, TriGate, High-K/Metal-Gate, embedded memories and advanced patterning, have dramatically increased the complexity of integrated processes. The cost and duration of technology development using antiquated trial-and-error experimental methodologies has concurrently increased. A more systematic virtual development approach is required for advanced technologies to achieve their time-to-market objectives. This paper looks at a new approach 3D semiconductor process modeling platform that offers wide ranging technology development capabilities in a simple, robust, high-speed application.