Mill-Max has developed a series of ultra-low and low profile spring pins for applications where above board height is limited. As packaging requirements for electronics continue to shrink in size, traditional interconnects don’t always fit the bill. For board-to-board or device-to-board connections, low profile spring pins are a practical solution.
Technical Paper / Application Note
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write a commentdidymus7 Posted Aug 8, 2012
Okay, then where is the information? Click on the PDF and you get the same page opening up in a new window.
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