RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies

Authored on: Mar 1, 2010 by Daniel D. Evans, Jr.

Technical Paper

This paper will explore the die and wire bonding requirements of several device cases in RF, Microwave, High Brightness LED, and Optoelectronic package formats when compared to mainstream semiconductor packaging.

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Palomar Technologies

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Palomar Technologies, formerly Hughes Aircraft, provides die attach solutions, wire bonding equipment, optoelectronic packaging systems and precision assembly services. Palomar... Read More

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RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case Studies

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